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Metal Matrix Composites
Metal matrix composites (MMCs) have become real engineering materials. MMCs have gone from "niche" materials to several high performance applications in aerospace, electronic packaging, automotive, and recreational products. This text focuses on the synergistic relationships among processing, microstructure, and properties of metal matrix composites. An introductory chapter is followed by a chapter each on reinforcements and common matrix materials. A chapter on the very important topic of processing of MMC is then presented. This is followed by a chapter on interfaces in MMCs, their characterization and techniques to obtain interfacial properties. Next there are chapters on monotonic mechanical and physical properties; followed by cyclic fatigue, creep, and wear resistance. We conclude with a chapter on applications of MMCs. The book is well-suited for upper level undergraduate students, graduate students, and as general source of reference on the subject for the professionals in the field.
Mechanics of Microelectronics
Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Force Sensors for Microelectronic Packaging Applications
This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.
