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Wafer Level 3-D ICs Process Technology
The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for improved performance, a number of companies, consortia and universities are researching methods to use short, monolithically-fabricated, vertical interconnections to replace the long interconnects found in 2-D ICs. Stacking disparate technologies to provide various combinations of densely-packed functions, such as logic, memory, MEMS, displays, RF, mixed-signal, sensors, and power delivery is potentially possible with 3-D heterogeneous integration, making this technology the "Holy Grail" of system integration.
Optical Interconnects : The Silicon Approach
Optical Interconnects provides a fascinating picture of the state of the art in optical interconnects and a perspective on what can be expected in the near future. It is composed of selected reviews authored by world leaders in the field, and these reviews are written from either an academic or industrial viewpoint. An in-depth discussion of the path towards fully-integrated optical interconnects in microelectronics is presented. This book will be useful not only to physicists, chemists, materials scientists, and engineers but also to graduate students who are interested in the fields of microelectronics and optoelectronics.
Optical Fiber Fusion Splicing
An up-to-date treatment of optical fiber fusion splicing incorporating all the recent innovations in the field. It provides a toolbox of general strategies and specific techniques that the reader can apply when optimizing fusion splices between novel fibers. It specifically addresses considerations important for fusion splicing of contemporary specialty fibers including dispersion compensating fiber, erbium-doped gain fiber, polarization maintaining fiber, and microstructured fiber. Finally, it discusses the future of optical fiber fusion splicing including silica and non-silica based optical fibers as well as the trend toward increasing automation. Whilst serving as a self-contained reference work, abundant citations from the technical literature will enable readers to readily locate primary sources.
Force Sensors for Microelectronic Packaging Applications
This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.
Energy Efficient Servers : Blueprints for Data Center Optimization
The book includes a deep examination of different features used in processors, memory, interconnects, I/O devices, and other platform components. It outlines the power and performance impact of these features and the role firmware and software play in initialization and control. Using examples from cloud, HPC, and enterprise environments, the book demonstrates how various power management technologies are utilized across a range of server utilization. It teaches the reader how to monitor, analyze, and optimize their environment to best suit their needs. It shares optimization techniques used by data center administrators and system optimization experts at the world’s most advanced data centers.
Materials for Information Technology : Devices, Interconnects and Packaging
The Engineering Materials and Processes series focuses on all forms of materials and the processes used to synthesise and formulate them as they relate to the various engineering disciplines.
Circuit and Interconnect Design for RF and High Bit-Rate Applications
Circuit and Interconnect Design for RF and High Bit-rate Applications covers each of these topics from theory to practice, with sufficient detail to help you produce circuits that are ‘first-time right’. A thorough analysis of the interplay between on-chip circuits and interconnects is presented.
Advances in optical fiber communications
Given the increasing importance of a globally interconnected world, driven by modern digital services and the need for fast and reliable access to digital resources, communication networks are one of the key infrastructures in today’s society. In this scenario, fiber optics and optical devices play a leading role, as they allow for unprecedented growth in our capacity to cope with the ever-increasing traffic demand. Optical transmission solutions range from high-speed networks based on coherent detection and advanced modulation formats for long-haul-level communications, to networks still relying on traditional intensity modulation and direct detection receivers for short-reach communications, down to intra-data center scenarios.
