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Fundamentals of manufacturing engineering using digital visualization
Offers a guide to core principles and practices of manufacturing engineering. It covers the design of, together with technological and measurement issues for, technical systems. Locating charts and setup schemes describing different machining processes are included. Concepts of product quality, with a focus on accuracy indicators, machining accuracy, roughness, and the impact of surface quality on exploitation properties are also explained. Furthermore, key machining methods, including turning, milling, hole machining, grinding, and gear machining, are analyzed in depth, covering their principles, applications, and techniques. The book is enriched by QR codes, linking to a mobile application presenting additional information about the content, for an interactive and extended learning experience. It also uses illustrations visualized with digital tools to promote a better understanding of the concepts.
Bonding in Microsystem Technology
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented.
