الصفحة 1
الصفحة 1
Novel food grade enzymes : Applications in food processing and preservation industries
Covers all the aspects of food-grade enzymes, including their classification, kinetics, microbial production, biosynthetic pathways, commodity-wise industrial applications, and downstream processing strategies. The broad focus of this book is on the application of various classes of enzymes in dairy, fruits and vegetables, cereals and oilseeds, meat and poultry, and brewing and food packaging industries. Certain recent areas such as nanotechnological perspective in enzyme immobilization, infusion strategies as well as its efficient usage in food packaging and preservation are some of the salient highlights of this book. This book also discusses the aspects related to application of enzymes in functional food development and shelf life extension of various commodities food products.
New Frontiers in Artificial Intelligence ; JSAI 2007 Conference and Workshops, Miyazaki, Japan, June 18-22, 2007, Revised Selected Papers
The technology of artifcial intelligence is increasing its importance thanks to the rapid growth of the Internet and computer technology. In Japan, the annual conference series of JSAI (The Japanese Society for Arti?cial Intelligence) has been playing a leading role in promoting AI research, and selected papers of the annual conferences have been published in the LNAI series since 2003. This book consists of award papers from the 21st annual conference of JSAI (JSAI 2007) and selected papers from the four co-located workshops.
Nanotechnology in Intelligent Food Packaging
This book is a state-of-the-art exposition of nanotechnology and food packaging which is undergoing rapid advancement. This book is specially designed with an emphasis on the state-of-the-art in nanotechnology and food packaging. It offers fascinating techniques for producing smart and active food packaging and also discusses its toxicity and the role that nanosensors play in detecting different pathogens in food packaging. The concluding chapters also explain recent developments concerning the incorporation of health supplements in food packaging and their future role in producing intelligent food packaging.
Misleading marketing communication : Assessing the impact of potentially deceptive food labelling on consumer behaviour
Presenting four complementary experimental studies targeting recurrent grey-zone scenarios on the Danish food market, the book illustrates the potential of the so-called ShopTrip test paradigm which simulates and registers real-life e-shopping behaviour as it unfolds while yielding new types of data against which opposing assessments of potential misleadingness can be matched. The results are discussed in the light of possible paths of theoretical explanation and implications for future regulative practices, including companies’ self-regulation.
Micro- and opto-electronic materials and Structures : Physics, mechanics, design, reliability, packaging ; Vol. I : Materials physics - materials mechanics ; Vol. II : Physical design - reliability and packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions.
Methods in consumer research ; Vol 1 : New approaches to classic methods
Brings together world leading experts in global consumer research who provide a fully comprehensive state-of-the-art coverage of advances in the classical methods of consumer science. The book touches on the latest developments in qualitative techniques, Including coverage of both focus groups and social media, While also focusing on liking, A fundamental principle of consumer science, Consumer segmentation, And the influence of extrinsic product characteristics, Such as packaging and presentation on consumer liking.
Metal Matrix Composites
Metal matrix composites (MMCs) have become real engineering materials. MMCs have gone from "niche" materials to several high performance applications in aerospace, electronic packaging, automotive, and recreational products. This text focuses on the synergistic relationships among processing, microstructure, and properties of metal matrix composites. An introductory chapter is followed by a chapter each on reinforcements and common matrix materials. A chapter on the very important topic of processing of MMC is then presented. This is followed by a chapter on interfaces in MMCs, their characterization and techniques to obtain interfacial properties. Next there are chapters on monotonic mechanical and physical properties; followed by cyclic fatigue, creep, and wear resistance. We conclude with a chapter on applications of MMCs. The book is well-suited for upper level undergraduate students, graduate students, and as general source of reference on the subject for the professionals in the field.
Mechanics of Microelectronics
Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The focus is on the electronic manufacturing process which, in its simplest form, involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes.
Information and communication technologies in tourism 2008 ; Proceedings of the International Conference in Innsbruck, Austria, 2008
This collection of papers presented at the ENTER 2008 Conference represents cutting-edge research on the topic of “eTourism: The View from the Future”. This year's 50 full research papers cover topics such as: user-generated content, dynamic packaging, mobile applications, context-aware systems, technology adoption, and recommender systems. All papers have undergone a double blind peer review process; therefore, the proceedings represent once more the state of the art of IT and Tourism research.
Handbook of Biodegradable Materials
Discusses the recent advances in biodegradation technologies and highlights emerging sustainable materials, including environmentally friendly nano-based materials for replacing plastics. It is useful to scientists, engineers, biologists, medical doctors and provides alternative eco-friendly materials to replace the currently used ones with harmful impact on the environment and life. The chapters present different types of alternative materials in diverse areas, such as food packaging materials, materials for construction and agricultural materials. The principles and types of biodegration technologies are described in depth.
Gallium Nitride Electronics
Gallium Nitride Electronics covers developments in III-N semiconductor-based electronics with a focus on high-power and high-speed RF applications. Material properties of III-N semiconductors and substrates; the state-of-the-art of devices and circuits, epitaxial growth, device technology, modelling and characterization; and circuit examples are discussed. The book concludes with device reliability aspects and an overview of integration and packaging. This comprehensive monograph and tutorial is based on more than a decade of research on materials, devices, and circuits.
Fuel Cell Electronics Packaging
Today's commercial, medical and military electronics are becoming smaller and smaller. At the same time, these devices are packed with more functions and demand more power. This power requirement is currently met almost exclusively by battery power. A fuel cell is like a battery converting chemical energy directly to electricity. The convergence of fuel cell technology and microelectronics is enabling the new design and manufacturing of fuel cells.Fuel Cell Electronics Packaging presents the latest developments in the technology convergence of microelectronics and fuel cells. Using the well established manufacturing methods used in microelectronics packaging, fuel cells can be further fabricated in smaller sizes with higher energy density, at a faster pace and lower cost.
Force Sensors for Microelectronic Packaging Applications
This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.
Food nanotechnology
Nanotechnology is increasingly being utilized within the food industry to create innovative products with new or improved properties. This book introduces the history of nanotechnology applications in the food industry. It then discusses the key physicochemical and structural characteristics of the different kinds of nanoparticles found in foods, as well as showing how these characteristics lead to their unique functional attributes. Applications of nanotechnology in the food and agricultural industries are then covered, including the creation of nanopesticides, nanofertilizers, nutrient delivery systems, functional ingredients, smart packaging materials, nanofilters, and sensors, as well as for the conversion of waste materials into value-added products. Finally, the potential toxicity of both organic and inorganic nanoparticles found in foods is critically assessed. The author is a Distinguished Professor of food science who uses physics, chemistry, and biology to improve the quality, safety, and healthiness of foods. He has published over a thousand scientific articles and numerous books in this area and is currently the most highly cited food scientist in the world. He has won numerous awards for his scientific achievements.
Essentials of industrial pharmacy
Presents various pharmaceutical processes and equipment that are frequently used for production of pharmaceutical dosage forms, along with quality control tests of these dosage forms. Pictorial/graphical illustrations provide easier understanding of complex pharmaceutical concepts, manufacturing processes of pharmaceutical dosage forms. Since it is imperative for pharmacy students to have a clear understanding of the basic concepts used in development of drugs into suitable and stable dosage forms.
Essentials in Food Science
Knowledge of food science is applicable to all persons, in diverse college majors. This text is designed with a user-friendly approach to Food Science for the non-major. This text reviews an Introduction to Food Components – quality and water. Next it addresses carbohydrates – including starches, pectins and gums, breads and pasta, vegetables and fruits. Then proteins – meats, poultry, fish, beans, eggs, milk and milk products are presented. Following proteins are fats and emulsions. Then sugars and sweeteners, and baked products, the latter of which builds upon basic food component knowledge. Various aspects of Food Production are examined, including food safety, preservation and processing, food additives and packaging. Government regulation and labeling complete the chapter information.
Essential oils as antimicrobial agents in food preservation
As the food industry responds to the increasing consumer demand for green, safe and sustainable products, it is reformulating new products to replace chemical synthetic food additives. Essential Oils as Antimicrobial Agents in Food Preservation provides a comprehensive introduction to the antimicrobial activity of plant essential oils and their application strategies in food preservation. It is aimed at food microbiology experts, food preservation experts, food safety experts, food technicians and students.
Electromagnetic Compatibility of Integrated Circuits : Techniques for low emission and susceptibility
Electromagnetic Compatibility of Integrated Circuits: Techniques for Low Emission and Susceptibility focuses on the electromagnetic compatibility of integrated circuits. The basic concepts, theory, and an extensive historical review of integrated circuit emission and susceptibility are provided. Standardized measurement methods are detailed through various case studies. EMC models for the core, I/Os, supply network, and packaging are described with applications to conducted switching noise, signal integrity, near-field and radiated noise. Case studies from different companies and research laboratories are presented with in-depth descriptions of the ICs, test set-ups, and comparisons between measurements and simulations. Specific guidelines for achieving low emission and susceptibility derived from the experience of EMC experts are presented.
Designing Inclusive Futures
Designing Inclusive Futures reflects the need to explore, in a coherent way, the issues and practicalities that lie behind design that is intended to extend our active future lives. This encompasses design for inclusion in daily life at home but also extends to the workplace and for products within these contexts.
