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Minimally Invasive Spine Surgery : A Surgical Manual
The second, completely revised and expanded edition of the successful surgical manual on minimally invasive spine surgery includes 51 chapters (including more than 20 new chapters) covering all current minimally invasive techniques in spine surgery. A complete survey of all microsurgical and endoscopic techniques with a special focus on semi-invasive injection techniques for diagnostic and therapeutic purposes in low back pain is given. The clear chapter structure with terminology, history, surgical principles, advantages/disadvantages, indications, access principles, complications, and results facilitates navigation through the manual. Topics include the principles of microsurgical and endoscopic treatment, spinal navigation and computer-assisted surgery, minimally invasive reconstruction, fusion, dynamic stabilization in fractures, degenerative disc disease, spinal stenosis, low back pain and deformities
Force Sensors for Microelectronic Packaging Applications
This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.
