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Open and Toroidal Electrophoresis : Ultra-High Separation Efficiencies in Capillaries, Microchips and Slabs
Written by one of the developers of Toroidal Capillary Electrophoresis (TCE), this book is the first to present this novel analytical technique, in detail, to the field of analytical chemistry. The exact expressions of separation efficiency, resolution, peak capacity, and many other performance indicators of the open and toroidal layouts are presented and compared.
Object-Oriented Data Structures Using Java ; 4th ed.
an essential resource for students learning data structures using the Java programming language. It presents both the traditional and modern data structure topics with an emphasis on problem-solving and object-oriented software design. Beginning early and continuing throughout the text, it introduces and expands upon the use of many Java features such as classes, objects, generics, polymorphism, packages, interfaces, library classes, inheritance, exceptions, and threads.
Nonlinear Elliptic and Parabolic Problems : A Special Tribute to the Work of Herbert Amann
The present volume is dedicated to celebrate the work of the renowned mathematician Herbert Amann, who had a significant and decisive influence in shaping Nonlinear Analysis. Most articles published in this book, which consists of 32 articles in total, written by highly distinguished researchers, are in one way or another related to the scientific works of Herbert Amann. The contributions cover a wide range of nonlinear elliptic and parabolic equations with applications to natural sciences and engineering. Special topics are fluid dynamics, reaction-diffusion systems, bifurcation theory, maximal regularity, evolution equations, and the theory of function spaces.
New Algorithms, Architectures and Applications for Reconfigurable Computing
New Algorithms, Architectures and Applications for Reconfigurable Computing consists of a collection of contributions from the authors of some of the best papers from the Field Programmable Logic conference (FPL’03) and the Design and Test Europe conference (DATE’03).
New Algorithms for Macromolecular Simulation
Molecular simulation is a widely used tool in biology, chemistry, physics and engineering. This book contains a collection of articles by leading researchers who are developing new methods for molecular modelling and simulation. Topics addressed here include: multiscale formulations for biomolecular modelling, such as quantum-classical methods and advanced solvation techniques; protein folding methods and schemes for sampling complex landscapes; membrane simulations; free energy calculation; and techniques for improving ergodicity. The book is meant to be useful for practitioners in the simulation community and for those new to molecular simulation who require a broad introduction to the state of the art.
Multi-processor system-on-chip 1 : Architectures
covers the key components of MPSoC: processors, memory, interconnect and interfaces. It describes advance features of these components and technologies to build efficient MPSoC architectures. All the main components are detailed: use of memory and their technology, communication support and consistency, and specific processor architectures for general purposes or for dedicated applications.
Multi-Carrier Spread Spectrum 2007 ; Proceedings from the 6th International Workshop on Multi-Carrier Spread Spectrum, May 2007,Herrsching, Germany
This combination known as multi-carrier spread spectrum (MC-SS) benefits from the advantages of both systems and offers high flexibility, high spectral efficiency, simple detection strategies, narrow-band interference rejection capabilities, etc. The basic principle of this combination is straightforward: The spreading is performed as direct sequence spread spectrum (DS-SS) but instead of transmitting the chips over a single carrier, several sub-carriers are employed. The MC modulation and demodulation can easily be realized in the digital domain by performing IFFT and FFT operations. The separation of the users’ signals can be performed in the code domain. MC-SS systems can perform the spreading in frequency direction, which allows for simple signal detection strategies. Since 1993, MC-SS has been deeply studied and new alternative solutions have been proposed.
Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost. Micromachined Thin-Film Sensors for SOI-CMOS Co-integration covers the challenges and interests and demonstrates the successful co-integration of gas-flow sensors on dielectric membrane, with their associated electronics, in CMOS-SOI technology.
Microfluidics diagnostics : Methods and protocols
Explores a wide range of microfluidic-based approaches that exploit the unique features of microfluidic devices, which hold significant potential in the field of diagnosis. Beginning with a section on microchips for sample preparation, including cell-free DNA, exosomes, and cells, the book continues by covering protein marker analysis and detection, single-cell analysis, analysis of bacteria and viruses, as well as human cell-based culture and analysis. Written for the highly successful Methods in Molecular Biology series, chapters include introductions to their respective topics, lists of the necessary materials and reagents, step-by-step and readily reproducible laboratory protocols, and tips on troubleshooting and avoiding known pitfalls.
Microfluidic Technologies for Miniaturized Analysis Systems
Microfluidic Technologies for Miniaturized Analysis Systems provides a comprehensive overview of the fluidic aspects of Lab-on-a-Chip technology. This book describes the most important and state-of-the-art microfluidic technologies and the underlying principles utilized in the implementation of fluidic protocols of miniaturized analysis systems. This book discusses many of the effects, outcomes, and techniques which are unique to microfluidic systems. The specific components of this technology toolbox are elucidated through research and examples presented by some of the most renowned experts in the field.
Microcontrollers in Practice
Stressing common characteristics and real applications of the most used microcontrollers, this practical guide provides readers with hands-on knowledge of how to implement three families of microcontrollers (HC11, AVR, and 8051). Unlike the rest of the ocean of literature on individual chips, Microcontrollers in Practice supplieS side-by-side comparisons and an overview that treats the systems as resources available for implementation. Packed with hundred of practical examples and exercises to foster mastery of concepts and details, the guide also includes several extended projects. By treating the less expensive 8-bit and RISC microcontrollers, this information-dense manual equips students and home-experimenters with the know-how to put these devices into operation.
MEMS/NEMS : (1) Handbook Techniques and Applications Design Methods, (2) Fabrication Techniques, (3) Manufacturing Methods, (4) Sensors and Actuators, (5) Medical Applications and MOEMS
Micro-Electro Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate. While the electronics are fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes),the micromechanical components are fabricated using compatible micromachining processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices. MEMS promises to revolutionize nearly every product category by bringing together silicon-based microelectronics with micromachining technology, thereby, making possible the realization of complete systems-on-a-chip.
Memories in Wireless Systems
This book is a guide which treats many components used in mobile communications, and in particular focuses on non-volatile memories. It emerges following the conducting line of the non-volatile memory in the wireless system: On the one hand it develops the foundations of the interdisciplinary issues needed for design analysis and testing of the system. On the other hand it deals with many of the problems appearing when the systems are realized in industrial production. These cover the difficulties from the mobile system to the different types of non-volatile memories.
Introduction to Reconfigurable Computing : Architectures, Algorithms, and Applications
“Introduction to Reconfigurable Computing” provides a comprehensive study of the field Reconfigurable Computing. It provides an entry point to the novice willing to move in the research field reconfigurable computing, FPGA and system on programmable chip design. The book can also be used as teaching reference for a graduate course in computer engineering, or as reference to advance electrical and computer engineers. It provides a very strong theoretical and practical background to the field of reconfigurable computing, from the early Estrin’s machine to the very modern architecture like coarse-grained reconfigurable device and the embedded logic devices.
Introduction to Advanced System-on-Chip Test Design and Optimization
SOC test design and its optimization is the topic of Introduction to Advanced System-on-Chip Test Design and Optimization. It gives an introduction to testing, describes the problems related to SOC testing, discusses the modeling granularity and the implementation into EDA (electronic design automation) tools. The book is divided into three sections: i) test concepts, ii) SOC design for test, and iii) SOC test applications.
Interior design masters
Contains 300 biographical entries of people who have significantly impacted design. They are the people, historical and contemporary, that students and practitioners should know. Coverage starts in the late-Renaissance, with a focus on the twentieth and twenty-first centuries. The book has five sections, with the entries alphabetical in each, so it can serve as a history text book and a reference guide. Theseventeeth- andeighteenth-century section covers figures from Thomas Chippendale to Horace Walpole. Thenineteenth-century section includes William Morris and Candace Wheeler. The earlytwentieth-century section presents modernisms design heroes, including Marcel Breuer, Eileen Gray, and Gilbert Rohde. The post-World War II designers range from Madeleine Castaing to Raymond Loewy. The final contemporary section includes Ron Arad and the Bouroullec brothers. These are the canonical figures who belong to any design history.
Interconnect-Centric Design for Advanced SoC and NoC
In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design.
Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
Integrated System-Level Modeling of Network-on-Chip Enabled Multi-Processor Platforms first gives a comprehensive update on recent developments in the area of SoC platforms and ESL design methodologies. The main contribution is the rigorous definition of a framework for modeling at the timing approximate level of abstraction. Subsequently this book presents a set of tools for the creation and exploration of timing approximate SoC platform models.
Integrated Circuit Test Engineering : Modern Techniques
Integrated Circuit Test Engineering provides a thorough-going and illuminating introduction to test engineering in analogue, digital and mixed-signal integrated circuits. This text is a valuable practical learning tool for advanced undergraduate and graduate electronic engineering students, an excellent teaching resource for their tutors and a useful guide for the practising electronic engineer.
Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The focus is on the electronic manufacturing process which, in its simplest form, involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes.
