Manufacturing systems and processes are becoming increasingly complex, making more rational decision-making in process control ...
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WeiterlesenDesigning Inclusive Futures reflects the need to explore, in a coherent way, the issues and practicalities that lie behind ...
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WeiterlesenGallium Nitride Electronics covers developments in III-N semiconductor-based electronics with a focus on high-power and high-speed ...
WeiterlesenIntegrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking ...
WeiterlesenIn the last few decades the effect of lead contamination on human health has received significant attention. Based on such ...
WeiterlesenWritten by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics ...
WeiterlesenMetal matrix composites (MMCs) have become real engineering materials. MMCs have gone from "niche" materials to several ...
WeiterlesenMicro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive ...
WeiterlesenPresenting four complementary experimental studies targeting recurrent grey-zone scenarios on the Danish food market, the ...
WeiterlesenThe technology of artifcial intelligence is increasing its importance thanks to the rapid growth of the Internet and computer ...
WeiterlesenFully updated to secure its place as the most comprehensive resource of professional information for creating packaging designs ...
WeiterlesenPackaging Technology and Engineering: Pharmaceutical, Medical and Food Applications begins with an overview of the history ...
WeiterlesenThe Syrian market have relied on the basic scarcity product tactics, but creativity and uniqueness have become more in need, ...
WeiterlesenThe Springer Handbook of Experimental Solid Mechanics documents both the traditional techniques as well as the new methods ...
WeiterlesenThermal Processing of Packaged Foods, Second Edition, discusses the physical and engineering aspects of the thermal processing ...
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