الصفحة 1
الصفحة 1
Digital transformation in semiconductor manufacturing ; Proceedings of the 1st and 2nd European advances in digital transformation Conference, EADTC 2018, Zittau, Germany and EADTC 2019, Milan, Italy
This book reports on cutting-edge electrical engineering and microelectronics solutions to foster and support digitalization in the semiconductor industry.
Development and characterization of a dispersion-encoded method for low-coherence interferometry
This book discusses an extension to low-coherence interferometry by dispersion-encoding. The approach is theoretically designed and implemented for applications such as surface profilometry, polymeric cross-linking estimation and the determination of thin-film layer thicknesses. During a characterization, it was shown that an axial measurement range of 79.91 µm with an axial resolution of 0.1 nm is achievable. Simultaneously, profiles of up to 1.5 mm in length were obtained in a scan-free manner. This marked a significant improvement in relation to the state-of-the-art in terms of dynamic range.
